02

2019

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04

New Energy Vehicles, 5G Mobile Phones The "Spring" of Third-Generation Semiconductors

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From fixed-line communications and fuel cars, to 5G smart phones and new energy vehicles, power electronics has become part of our lives, and the transformation of this process can not be separated from the wide bandwidth semiconductors - third-generation semiconductors.

 From fixed-line communications and fuel cars, to 5G smart phones and new energy vehicles, power electronics has become part of our lives, and the transformation of this process can not be separated from the wide bandwidth semiconductors - third-generation semiconductors.
 
  Third-generation semiconductors have a high breakdown field, high saturation electron velocity, high thermal conductivity, high electron density, high mobility and other characteristics, so the industry known as solid-state light source, power electronics, microwave radio frequency devices, "core" and optoelectronics and microelectronics industries, "the new engine! ". At present, the development of better wide-band semiconductor is mainly SiC and GaN.

 
  According to a report by IHS IMS Research, in the next decade, driven by the demand for power supplies, solar photovoltaic (PV) inverters and industrial motors, the emerging SiC and GaN power semiconductor market will grow steadily at a rate of 18%, and it is expected that by 2022, global sales of SiC and GaN power components will increase significantly to $2.8 billion from $143 million in 2012. a significant increase to $2.8 billion.
 
  As electric vehicles and autonomous driving are the two major driving factors driving the automotive market forward. There are three major applications in automobiles that are power related, namely chargers, DC-DC converters and traction inverters. Of these three applications, the traction inverter is by far the one that can benefit the most from GaN and SiC technology. This is because the use of GaN and SiC devices reduces the weight of the vehicle, improves energy efficiency, and allows electric vehicles to travel longer distances while using smaller batteries and cooling systems.
 
  The demand for SiC power devices is skyrocketing, driven by the development of new energy electric vehicles in recent years. According to Yole, the SiC power device business reached $302 million in 2017, up 22% from $248 million in 2016. The Tesla Model 3, which employs SiC MOSFET modules, realized capacity growth, and Yole estimates that by 2023, the SiC power semiconductor market will reach $1.5 billion.


 
  Thomas Neyer, Technical Fellow and head of the SiC development area at ON Semiconductor, said, "The SiC market today is already a $350 million market and is expected to grow to $1.3 billion over the next five years."
 
  In addition to the focus on new energy electric vehicles, smartphones are also one of the key concerns, and their efficiency, performance, and size are in dire need of constant improvement.
 
  In the smartphone built-in component size, domestic enterprises Ningbo Semiconductor IC and Suzhou Yizui Semiconductor on the joint announcement of the realization of gallium arsenide RF front-end module wafer-level microsystem heterogeneous integration, which is currently the industry's most compact RF front-end device, mainly for the 4G and 5G smartphone market, to meet the demand for further miniaturization of its RF front-end module.
 
  In the 5G era, the demand for third-generation semiconductors is rising, because by then a smartphone not only needs to be thin and lightweight, but also may require 16 PA (power amplifier) chips, plus the need for more base stations, large-scale antennas (Massive MIMO), filters and so on.

10

2024-07

Deli Electronics 2024 Munich Electronics Fair in Shanghai ended successfully!

On July 10th, the three-day Electronica 2024 Munich concluded successfully at the New International Expo Center (Shanghai). Looking back on this event, we feel that we have gained a lot from it. We would like to express our sincere thanks to all the customers and visitors, and we will continue to fulfill our trust and support in the future. We will meet again next year!

09

2024-07

Triad's booth in full swing, 2024 Electronica Shanghai Day2 newsletter

On the second day (July 9) of electronica China 2024 in Munich, Triad was there as scheduled.

08

2024-07

Deli Electronics brings you into the 2024 Munich Electronics Show Shanghai

On July 8, 2024, all eyes are on the show. Huizhou Deli Electronics Co., Ltd. debuts at Electronica 2024 in Munich.

28

2024-06

Deli Electronics Invites You to Electronica Shanghai 2024

July 8-10, 2024, Huizhou Triad Electronics Co., Ltd. invites you to the 2024 Munich Electronics Show in Shanghai, where Triad will be in Hall E6, Booth 6729 to meet with all the guests face to face to discuss the new direction of the future development of science and technology!

03

2019-04

Measurement and Diagnosis of Common Mode Inductors - An Overview of Common Mode Chokes

Filter design assumes that the two parts, common mode and differential mode, are independent of each other. However, the two components are not truly independent because the common mode choke can provide considerable differential mode inductance. This differential mode inductance can be simulated by a discrete differential mode inductor.   In order to take advantage of the differential mode inductance, common mode and differential mode should not be done at the same time but in a certain order during the design of the filter. First, the common mode noise should be measured and filtered out. By using a DifferentialModeRejectionNetwork, the differential mode component can be eliminated, thus

03

2019-04

Vehicle control electronic product software development process

The software development process for automotive vehicle control electronics is a "V" shaped development process. The "V" shaped development process is divided into five phases, i.e., functional design, prototype simulation, code generation, hardware-in-the-loop simulation-HIL, and calibration.    The main tool used in the functional design stage is MATLAB, and by using Simulink, Stateflow, and other tools provided by MATLAB, we complete the tasks of designing the control scheme, designing the functional modules, designing the control algorithms, etc., and carry out the preliminary simulation work. The main tool used in the prototype simulation stage is dSPACE. using dSPA

03

2019-04

Identification of Color Ring Resistors

Black, Brown, Red, Orange, Yellow, Green, Blue, Purple, Gray, White, Gold, Silver   0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 5%, 10%.   The penultimate ring indicates the number of zeros.   The last digit, the error.

03

2019-04

Semiconductor triode discrimination - simple judgment

Test transistor with a multimeter (1) will be played to the multimeter beeping file, red pen fixed a pole with a black pen to try the other two poles were a few hundred readings when the red pen is the base pole. Repeatedly try.   (2) to be tested out of the base, with a red pen connected to the base (B) multimeter has a reading of the triode for NPN (3) to be tested out of the base, with a black pen connected to the base (B) multimeter has a reading of the triode for the PNP general number of a motherboard is only a few.

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